RRI.CO.ID, Jakarta - A proposed partnership between University of Indonesia (UI) and Harbin Institute of Technology (HIT) signals a push to deepen cross-border collaboration in education and technology, as both institutions explore joint programs to strengthen global talent development.

UI Deputy Rector for Academic Affairs Mahmud Sudibandriyo emphasized in Depok on Thursday, April 23, 2026, the university’s commitment to prioritizing international collaboration.

“We are open to developing cooperation in various forms, ranging from student and staff exchanges to double degree programs and joint research. UI also already has a digital education platform that can be developed together with international partners,” he said, as quoted by Antara.

HIT Deputy President Qinyu Zhang, meanwhile, highlighted the importance of international collaboration in strengthening cultural exchange and advancing science, particularly in engineering.

“We hope this cooperation can serve as a bridge connecting educational institutions in China and Indonesia and encourage the development of global talent in the future,” he said during a visit to the UI campus in Depok.

Both parties also discussed developing digital education programs through a Shenzhen-based digital academy initiative, which includes master’s and doctoral programs in technology, as well as training based on artificial intelligence.

The program also opens opportunities for micro credentials and short-term certifications as part of human resource capacity building.

Dean of the Faculty of Engineering at UI, Kemas Ridwan Kurniawan, highlighted that the faculty offers a range of international programs, including undergraduate international classes, double degree tracks, and joint degrees that could be expanded with partners in China.

He noted further opportunities for collaboration in smart city development, data engineering, artificial intelligence, and the establishment of joint research centers.

Both sides also explored the possibility of organizing international joint workshops, enabling students to gain direct academic and industry experience while fostering cross‑cultural understanding.

The initiative is expected to add value through academic credit recognition for participants.

As a follow‑up, UI and HIT will hold technical discussions to shape more concrete forms of cooperation, including the potential signing of a Memorandum of Understanding (MoU). ***